Product Description

Aluminum Nitride substrate material with its excellent ability to dissipate heat up to 200 W/mK, is the answer to the present trend 
toward miniaturization of high power microelectronic circuits and other high thermal hazard-free applications.

Valley has in stock AlN substrates and AlN wafers with thermal conductivity of 175 W/mK and 200 W/mK to meet
a variety of specification requirements.

Payment Terms︰ T/T,Western union,Paypal

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